www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 1 of 8 s pec n o : ? ? s s p p e e c c i i f f i i c c a a t t i i o o n n customer product ? saw filter model no hdf 4 0 8 at smd - 3 prepared checked approved ? d a t e 200 8 - 8 - 1 4 ? ? ?? shoulder electronics limited ?? c ustomer received: c hecked ? approved d ate
saw filter hdf 4 0 8 at smd - 3 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 2 of 8 ?? history record date spec . no . ?? part no . ??? customer no . modify content ? remark
saw filter hdf 4 0 8 at smd - 3 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 3 of 8 1. scope this specification shall cover the characteristics of saw filter with f4 0 8 at used for the page system. 2. electrical specification ac voltage vpp 10v50hz/60hz operation temperature - 20 to +60 storage temperature - 45 to +85 rf power dissipation 27 dbm electronic characteristics 2 - 1.typical frequency response 2 - 2.electrical characteristics part number f4 0 8 at unit nominal center frequency (fo) 4 0 8 mhz insertion loss (4 0 6 .0~4 10 .0 mhz) 3.5 max db 0~390mhz 20min db 440mhz~1700mhz 20min db 1700mhz~2500mhz 18min db 4 13 mhz 12min db 4 1 6.0 mhz ~4 20 .0 mhz 35min db r ipple (in passband) 1.0max db vswr 2.0 max input/output impedance(nominal) 50//0 /pf
saw filter hdf 4 0 8 at smd - 3 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 4 of 8 3. test circuit 4. dimension 5. environmental characteristics 5 - 1 high temperature exposure subject the device to +85 for 16 hours. then release the filter into the room conditions for 24 hours prior to the measurement. it shall fulfill the specifications i n table 1. 5 - 2 low temperature exposure subject the device to - 20 for 16 hours. then release the device into the room conditions for 24 hours prio r to the measurement. it shall fulfill the specifications in table 1. 5 - 3 temperature cycling subject t he device to a low temperature of - 40 for 30 minutes. following by a high temperature of +80 for 30 minutes. then release the device into the room conditions for 24 hours prior to the me a surement. it shall meet the specifications in table 1. 5 - 4 resist ance to solder heat dip the device terminals no closer than 1.5mm into the solder bath at 260 10 for 10 1 sec. then release the device into the room conditions for 4 hours. the device shall 1. ground 2. input/output 3. ground 4. ground 5. ground 6. input/output 7. ground 8. ground
saw filter hdf 4 0 8 at smd - 3 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 5 of 8 meet the specifications in table 1. 5 - 5 solderability subje ct the device terminals into the solder bath at 245 5 for 5s, more than 95% area of the terminals must be covered with new solder. it shall meet the specifications in table 1. 5 - 6 mechanical shock drop the device randomly onto the concrete floor from th e height of 1m 3 times. the device shall fulfill the specifications in table 1. 5 - 7 vibration subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of 1.5 mm at 10 to 55 hz. the device shall fulfill the specifications in table 1. 5 - 8 lead fatigue 5 - 8 - 1 pulling test weight along with the direction of lead without an shock 1 kg . the device shall satisfy all the initial characteristics. 5 - 8 - 2 bending test lead shall be subject to withstand against 90 bendi ng with 450g weight in the d i rection of thic kness. this operation shall be done toward both direction. the device shall show no evidence of damage and shall satisfy all the initial electrical characteristics. 6. remark 6.1 static voltage static vol tage between signal load & ground may cause det e rioration &destruction of the component. please avoid static voltage. 6.2 ultrasonic cleaning ultrasonic vibration may cause det e ri oration & destruction of the component. please avoid ultrasonic cleanin g 6.3 soldering only leads of component may be soldered. please avoid soldering another part of component. 7. packing 7.1 dimensions (1) carrier tape: figure 1 (2) reel: figure 2 (3) the product shall be packed properly not to be damaged dur ing transportation and storage. 7.2 reeling quantity 1000 pcs/reel 7?? 3000 pcs/reel 13?? 7.3 taping structure (1) the tape shall be wound around the reel in the direction shown below.
saw filter hdf 4 0 8 at smd - 3 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 6 of 8 (2) label device name user produ ct name quantity lot no. (3) leader part and vacant position specifications. 8. tape specifications 8.1 tensile strength of carrier tape: 4.4n/mm width 8.2 top cover tape adhesion (see the below figure) (1) pull off angle: 0~15 o (2) speed: 300mm/min.
saw filter hdf 4 0 8 at smd - 3 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 7 of 8 (3) force: 20~70g [figure 1] carrier tape dimensions [unit:mm] w f e p0 p1 p2 d0 d1 t1 t2 a b 12.0 0.3 5.5 0.05 1.75 0.1 4.0 0.1 8.0 0.1 2.0 0.05 ? 1.5 0.1 ? 1.0 0.25 0.3 0.05 2.10 0.1 6.40 0.1 5.20 0.1 [figure 2]
saw filter hdf 4 0 8 at smd - 3 www.shoulder.cn tel:0755 - 82916880 fax:0755 - 82916881 e - mail: info@shoulder.cn page 8 of 8 [un it:mm] a b c d e w t r ? 330 1.0 ? 100 0.5 ? 13 0.5 ? 21 0.8 2 0.5 13 0.3 3 max. 1.0 max.
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